CPUs
Qualcomm this morning is taking the wraps off of a new smartphone SoC for the mid-range market, the Snapdragon 7s Gen 3. The second of Qualcomm’s down-market ‘S’ tier Snapdragon 7 parts, the 7s series is functionally the entry-level tier for the Snapdragon 7 family – and really, most Qualcomm-powered handsets in North America. With three tiers of Snapdragon 7 chips, the 7s can easily be lost in the noise that comes with more powerful chips. But the latest iteration of the 7s is a bit more interesting than usual, as rather than reusing an existing die, Qualcomm has seemingly minted a whole new die for this part. As a result, the company has upgraded the 7s family to use Arm’s current Armv9 CPU cores...
Haswell at IDF 2012: 10W is the New 17W
Earlier this week Intel let a little bit of information leak about Haswell, which is expected to be one of the main focal points of next week's Intel Developer...
43 by Anand Lal Shimpi on 9/7/2012
The AnandTech Podcast: Episode 3
This week on the AnandTech Podcast we discuss the latest in chip architecture disclosures (both intentional and leaked) from AMD and Intel. Steamroller, Jaguar and Valleyview are all on...
23 by Anand Lal Shimpi on 9/3/2012MultiCore Enhancement: The Debate About Free MHz
If you have been keeping up to date with any of the AnandTech motherboard reviews lately, there has been one topic that has been hot on my lips, and...
66 by Ian Cutress on 8/29/2012
Details on Intel's Valleyview SoC Emerge: 22nm Atom with Ivy Bridge Graphics
First, a recap. Clover Trail is the dual-core 32nm Atom platform that will power the first generation of value x86 Windows 8 tablets (and go up against ARM based...
22 by Anand Lal Shimpi on 8/28/2012
AMD Hires Ex-Intel Labs Architect, John Gustafson, As Chief Graphics Product Architecture
After a bunch of high profile departures earlier this year, AMD has been trying to turn the tides as of late with high profile hires. Kicking it off was...
17 by Anand Lal Shimpi on 8/28/2012
AMD's Steamroller Detailed: 3rd Generation Bulldozer Core
Today at the annual Hot Chips conference, AMD’s new CTO Mark Papermaster unveiled the first details about the Steamroller x86 CPU core. Steamroller is the third instantiation of AMD’s Bulldozer...
126 by Anand Lal Shimpi on 8/28/2012
The AnandTech Podcast: Episode 1
Last Friday, Brian Klug, Ian Cutress and myself took an hour to discuss a lot of what was on our minds lately. At a high level we discussed building...
59 by Anand Lal Shimpi on 8/13/2012
AMD Introduces FirePro A300 & A320 APUs: Trinity for Graphics Workstations
At its Financial Analyst Day earlier this year, AMD laid out its vision for the future of the company. For the most part the strategy sounded a lot like...
42 by Anand Lal Shimpi on 8/7/2012
Apple A4/A5 Designer & K8 Lead Architect, Jim Keller, Returns to AMD
We haven't covered every significant departure from AMD here, but there have been many. Carrell Killebrew and Eric Demers were among the earliest high-profile AMDers to leave. More recently...
24 by Anand Lal Shimpi on 8/1/2012
Intel Announces Xeon Phi Family of Co-Processors – MIC Goes Retail
As conference season is in full swing, this week’s big technical conference is the 2012 International Supercomputing Conference (ISC) taking place over in Hamburg, Germany. ISC is one of...
54 by Ryan Smith on 6/19/2012
AMD Llano HTPC Builders Guide
Home Theater PCs (HTPCs) are becoming more and more popular due to a number of reasons. The desire of consumers to watch and enjoy their media, be it Blu-rays/DVDs...
76 by Ganesh T S on 6/5/2012
Thunderbolt on Windows Part 2: Intel's DZ77RE-K75 & ASUS' P8Z77-V Premium
Quad-core mobile Sandy Bridge, 2.5" SSDs and Thunderbolt together have allowed me to use a notebook as my primary work machine. I get all of the portability benefits of...
116 by Anand Lal Shimpi on 6/3/2012
The Rest of the Ivy Bridge Die Sizes
AnandTech reader Grant Vezina pointed out in the comments to my last post that Intel properly documents almost all Ivy Bridge die sizes in the mechanical specifications pages of...
14 by Anand Lal Shimpi on 5/31/2012
Dual Core/GT2 Ivy Bridge Die Measured: ~121mm^2
I mentioned Intel's desired secrecy around die sizes and transistor counts for the majority of the Ivy Bridge lineup in our 3470 review from this morning. While I can't...
18 by Anand Lal Shimpi on 5/31/2012
Intel Dual-Core Mobile Ivy Bridge Launch and i5-3427U Ultrabook Review
Back in April, Intel launched their latest CPU architecture along with their 22nm process: Ivy Bridge. Similar to the Sandy Bridge launch last year, the first parts to come...
64 by Jarred Walton on 5/31/2012
Intel Core i5 3470 Review: HD 2500 Graphics Tested
Intel's first 22nm CPU, codenamed Ivy Bridge, is off to an odd start. Intel unveiled many of the quad-core desktop and mobile parts last month, but only sampled a...
67 by Anand Lal Shimpi on 5/31/2012
More Good News from AMD: 30 Additional Free AFDS Passes Available
You guys really impressed AMD with how quickly you took advantage of their 50 free passes to AMD's Fusion12 Developer Summit (AFDS). After seeing that a couple of commenters...
14 by Anand Lal Shimpi on 5/29/2012
Replacing my HTPC with a mini ITX System
Free time is hard to come by these days. Since the beginning of the year I've hit Vegas, Barcelona, Santa Clara, New York, Santa Clara (again), Austin, Seattle, Chicago...
56 by Anand Lal Shimpi on 5/24/2012
ASUS Zenbook Prime (UX21A) Review: The First of the 2nd Gen Ultrabooks
The first round of Ultrabooks were mostly underwhelming. It shouldn't be a surprise, but many of the efforts were just half hearted at best. Of the companies who shipped...
192 by Anand Lal Shimpi on 5/22/2012
Answered by the Experts: Heterogeneous and GPU Compute with AMD’s Manju Hegde
AMD’s Manju Hegde is one of the rare folks I get to interact with who has an extensive background working at both AMD and NVIDIA. He was one of...
15 by Anand Lal Shimpi on 5/21/2012
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